Infineon and Schweizer Electronic want to jointly increase the efficiency of silicon carbide chips. To this end, they are developing an approach to embed 1200 V CoolSiC chips from Infineon directly into printed circuit boards.

Until recently, it seemed clear that microLEDs were the most promising technology to realize displays for augmented reality (AR) glasses. However, an alternative technology is now moving to the forefront.

Beckhoff Automation has developed the TwinCAT Chat Client for its TwinCAT XAE engineering environment, making Large Language Models (LLMs) such as ChatGPT from OpenAI usable for programming control applications.

TQ-Group announced new embedded modules in various form factors at embedded world. Included are the embedded modules »TQMa62xx« (pluggable) and »TQMa62xxL« (solderable). They are based on the »AM62x« processor family from Texas Instruments.

Siemens has presented a completely virtual controller for the first time: the Simatic S7-1500V. It enables central management via Industrial Edge, is compatible with the TIA portfolio (Totally Integrated Automation) and is part of the new OT-IT interoperable portfolio "Industrial Operations X".

In order to push the decarbonization of commercial vehicles, ZF's Commercial Vehicle Solutions division (CVS) presents a key product for e-mobility: A new air compressor supplies the fuel cell with a high volume of air, thus making an efficient chemical reaction for power generation possible.

Hema electronic in Aalen is strengthening its team: Since the beginning of the year, Dr. Tony Albrecht has been responsible for hardware and software as head of development. With him, two additional developers were hired.