Infineon Technologies expands its 650 V CoolMOS CFD7A portfolio with the QDPAK package. This package family is designed to provide equivalent thermal capabilities with improved electrical performance over the well-known TO247 THD devices.
Congatec introduces six new COM Express Compact Computer-on-Modules based on 13th Gen Intel Core processor featuring highest ruggedness. They are designed to withstand even extreme temperature ranges of -40°C to +85°C.
Siemens presented a new version of its TIA Portal (Totally Integrated Automation) at the SPS trade fair. Version 19 of the engineering framework simplifies motion control, making it intuitive to use even for non-experts and new users.
Alchip Technologies rolled out the semiconductor industry’s first Automotive ASIC platform at the Design Solutions Forum 2023. The platform targets the specialized needs of the global automotive industry.
Porsche is making the Zuffenhausen production site fit for the future with extensive conversion and expansion measures: in future, the assembly line for two-door Porsche sports cars will also produce the electric sports cars of the next 718 generation in addition to the models with boxer engines.
In today's modern manufacturing, the drive to maximize profits while increasing efficiency and quality necessitates seamless collaboration among various systems. From the shop floor to enterprise IT applications, these systems must collaborate to drive success in the era of digital transformation.
Formerly known mainly for classic industrial robots, Stellantis subsidiary Comau, based in Grugliasco near Turin, now also offers cobots and exoskeletons in addition to a wide range of advanced automation products and solutions, and has established itself in industries outside automotive.
Renesas Electronics has introduced a new RX MCU for high-end industrial sensor systems. The latest addition, the RX23E-B, is a 32-bit device featuring a high-precision analog front end (AFE), specifically designed for systems that demand fast and accurate analog signal measurements.
On the SPS trade fair, ODVA (Open DeviceNet Vendors Association) announced that it has added a device-based firewall to CIP Security, the cybersecurity network extension for EtherNet/IP, to better defend against intruders.
The Universal Debug Engine (UDE) from PLS now supports the new S32M2 microcontrollers from NXP. The MCUs increase efficiency in body and comfort applications.
Seco Northern Europe appoints Luca Buscherini as Managing Director of the Seco Group in Hamburg. Buscherini succeeds Dirk Finstel, who will remain with the company in a different position focusing on strategy development for the entire group.
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