This June marked the first time since records began in 1976 that IC sales in a June slumped from May of the same year, according to IC Insights.

The global consumer service robotics market recorded 25% year-on-year shipment growth in 2021 and is estimated to grow at a CAGR of 27% over the next four years, according to the latest research from Counterpoint's IoT service.

Many exciting projects can be implemented with the Raspberry Pi Pico. Tools, developer code and additional hardware help. For example, the new mini color display from Display Visions.

August 5th is the tenth anniversary of the landing of the rover »Curiosity« on Mars. Husqvarna, manufacturer of robotic mowers, is marking the anniversary in its own way: With a very special update for 100,000 of its »Automower«.

Volkswagen Group China has unveiled the first prototype of an electrically powered, vertical take-off and landing passenger drone (eVTOL). The company is thus breaking new ground in the development of all-electric and sustainable individual mobility concepts.

Dirk Finstel is the new Managing Director and CEO of Seco Northern Europe, succeeding Stefan Heczko. He had held the position since 2020 and remains with Seco as a member of the advisory board. With Finstel, the company was able to gain a long-standing industry expert.

The next Automotive SerDes Conference will take place as a live event on May 4, 2023 in Munich.

Siemens Smart Infrastructure (SI), an expert in digital buildings, has completed the acquisition of Brightly Software, a U.S.-based software-as-a-service (SaaS) provider of asset and maintenance management solutions.

Infineon Technologies offers secured NFC tags that meet high security requirements for proving authenticity.

Electrification and networking mean that the automotive industry has to invest more and more in software. Expenditure could more than double by 2030. The way out: new design concepts in which the vehicle is built around a software platform from the outset.

InnovationLab and ISRA have developed a new additive manufacturing process for copper-based solderable circuits whose advantages represent a breakthrough.