Mobileye has chosen to end the internal development of next-generation frequency modulated continuous wave (FMCW) lidars for use in autonomous and highly automated driving systems.

TrendForce’s latest projections show global shipments of AMOLED smartphone panels are anticipated to surpass 840 million units in 2024, reflecting a remarkable growth of almost 25 Percent from 2023.

According to the manufacturer NXP Semiconductors, “Trimension SR250” is the industry's first single-chip solution that combines on-chip data processing with ultra-wideband (UWB) radar technologies for reliable localization and detection at close range.

AI is a hype topic, no company can ignore it anymore. Leen Balcaen, Vice President Product Management SD and HD Maps at Here, is also convinced that Here Technologies has significant advantages through the use of artificial intelligence (AI).

ROHM and United Automotive Electronic Systems Co., Ltd., (UAES), a leading Tier 1 automotive supplier in China, have recently entered into a long-term supply agreement for SiC power devices.

Gliwa has now integrated the UDE Universal Debug Engine from PLS Programmierbare Logik & Systeme into T1.timing. This enables the customer to analyse, validate and optimize the timing behaviour of electronic control units (ECUs) based on timing information directly collected from real hardware.

Thanks to a plug-in for the widely used Simatic S7 PLCs from Siemens, applications created with version 5.6 of the no-code vision software Merlic from MVTec Software can be more easily integrated into corresponding production environments. The new release is scheduled to be launched on October 16.

Global sales of semiconductor manufacturing equipment rose by 4% year-on-year to USD 26.8 billion in the second quarter of 2024.

New current sensors utilizing Allegro’s patented XtremeSense TMR technology represent the first products launched since the company’s acquisition of Crocus Technologies.

The robotics and automation group Kuka has founded a new business unit: “Kuka Digital”. Its purpose is the end-to-end digitalization of various machines and systems, from the first 3D simulation to connectivity and data analysis through to the use of artificial intelligence.